Micron Technology will invest 1.5 trillion yen ($9.6 billion) to build a new plant in Hiroshima in western Japan to produce advanced high-bandwidth memory (HBM) chips, the Nikkei reported on Saturday, citing people familiar with the matter.

The U.S. chipmaker aims to start construction at an existing site in May next year and begin shipments around 2028, with Japan’s Ministry of Economy, Trade and Industry providing up to 500 billion yen for the project, the Nikkei said.

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